3m Potting Compound For Electronics

It takes totally 4 hours to cure the encapsulated connections.

3m potting compound for electronics.

3m scotch weld epoxy potting compound dp270 is low viscosity for easy dispensing and potting. Both prevent fluid ingress or egress and are found throughout industry but are especially common in applications exposed to the elements or with high value internal components including transportation metalworking electronics and construction. Formulated to draw heat away from sensitive electronic components these potting compounds have higher thermal conductivity than standard potting compounds. And is non corrosive.

Potting compounds for effective potting of electronics to protect against environmental influences improve mechanical strength high electrical insulation. It provides initial strength in about 3 hours with approximately 2 500 psi at 72 f 22 c. The multi purpose moisture sealing resin ensure curing at room temperature and is designed to resist dripping or sagging. Get it as soon as mon jun 22.

Potting and encapsulating encases the entire part or chamber to protect the components inside. Use them to encase electronic assemblies for protection from dust chemicals moisture mechanical shock and vibration. Rigid and wear resistant epoxies are the strongest of the potting. Seals are required along the length of a seam.

3m scotch weld epoxy potting compound dp270 black 200 ml duo pak. Our 3m glass bubble technology reduces weight delivers high strength to weight ratio and has a consistent fast flow through dispensers. 3m scotch weld epoxy potting compound dp270 black 200 ml duo pak. Max epc a b electronic potting compound for embedding electronic printed circuit boards encasing electrical circuitry waterproofing insulating high thermal conductivity 40 fl oz.

It is non corrosive to copper minimal exotherm and very low shrinkage making it well suited for potting and bonding electronic and electrical components. Get it as soon as wed sep 16. Potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits. Additionally our 3m scotch weld epoxy potting compound dp270 is low viscosity for easy dispensing and potting.

3 0 out of 5 stars 2. 3m scotchcast potting kit 2136 includes black potting compound that helps in adhering copper copper alloy and stainless steel materials. 3 0 out of 5 stars 2. At temperatures above 40 f 18 c the compound will firm up in minutes.

Encapsulated connections should be allowed to cure for 4 hours prior to submersion. Epoxy compound features 70 minute work life 3m scotch weld epoxy potting compound dp270 is a rigid two part epoxy adhesive with a 1 1 mix ratio and 70 minute work life.